Cadence And TSMC Expand Partnership For Advanced AI Chip Design And 3D-IC Technologies

Cadence has expanded its partnership with TSMC to enhance capabilities for AI and high-performance computing (HPC) designers. The collaboration includes certification for TSMC's A14 process, new silicon-proven IP for N3P and N2P technologies, and support for 3D-IC design flows. This partnership aims to facilitate advanced chip design across TSMC's latest process technologies, including N3, N2, A16, and A14.