GlobalFoundries Lands $2 Billion TSMC Deal to Expand US AI Chip Packaging
10/8/2026
Impact: 75
Technology
GlobalFoundries Inc. (NASDAQ: GFS) has entered a $2 billion, five-year manufacturing agreement with Taiwan Semiconductor Manufacturing Co. (NYSE: TSM) to supply U.S.-produced silicon interposers for TSMC's advanced packaging ecosystem. The expansion at GlobalFoundries' Malta, New York facility aims to support high-performance computing and AI workloads, with volume production expected to start in the first half of 2028. Following the announcement, GFS shares rose 4.46% to $50.22.
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