'Samsung, SK Hynix Upgrading China Plants To Make More Advanced Chips, People Say' - Reuters Exclusive

Samsung Electronics plans to upgrade its Xian plant to produce 286-layer flash-memory chips by 2027, while SK Hynix aims to manufacture chips with 240 or more layers at its Dalian operations. Additionally, SK Hynix may seek US approval for research and development on advanced technology at its Dalian site. Both companies are enhancing their Chinese factories to meet rising AI demand and counter competition from a growing Chinese rival, amid challenges posed by US export controls on chip-making equipment.